Product Description & Info
The Coollaboratory Liquid MetalPad ist the first heat conduction pad, which
is composed of 100% metal and melts with just less heating (BurnIn-process),
then it confects its superior heat transfer. It dissipates the heat fast and
efficiently and doesn't have to hide from the best heat conduction paste. The
simple, clean and fast installation turns the Liquid MetalPad into the ultimate
heat conduction medium for HighEnd PCs. The Liquid MetalPad can be used with all
heatsink and waterblock materials, for instance aluminum or copper. It doesn't
age and doesn't have to be freshened up/replaced every few months.
The Coollaboratory Liquid MetalPad is RoHS compliant and nontoxic.
The Coollaboratory Liquid MetalPad is delivered in a transparent
blister-package and contains three Liquid MetalPads. Additionally there is a detailed printed manual included and a cleaning set for removal / cleaning of the contact area before and after using the Liquid
The pad is 38 x 38 millimeters and is suitable for any of today's modern
processors. Coollaboratory provides a template to allow for trimming the pad to
suit your processor's size.
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