Enzotech BMR-C1 Forged Copper BGA Ramsinks |
Product Description & Info
Enzotech's BMR-C1 BGA Ramsinks are designed to offer exceptional heat
dissipation for BGA memory chips on video cards and motherboards. BMR-C1 RAM
sinks are made using a forged copper process which produces a dense material
that is extremely efficient at heat extraction. The BMR-C1 RAM Sink is far
superior to traditional heat sinks currently found on the market and provides
the best thermal conductivity available to dissipate heat from RAM in your
system.
Features
- ATI® & NVIDIA® Compatible
- Pure forged copper
- Easy installation by using 3M™ 8815 Thermal Tape
- Multipack - Eight (8) piece set
Specifications
|
Dimensions (mm)
|
14(L) mm x 14mm(W) x 14mm(H) |
|
Material
|
C1100 Forged Copper |
|
Weight
|
7g (Each) |
|
Thermal Adhesive
|
3M™ 8815 Thermal Tape (Datasheet) |
Additional Photos
Manual
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