Product Description & Info
Specifications:
Size: 1.5 gram tube
Thermal Conductivity: 4.5 W/m-K (data acquired with an ASTM D -
5470 thermal interface test instrument)
Thermal Resistance: 0.25°C-cm2/W@ 100 µ BLT
Electrically Conductive: No
Description:
Each tube of IC Diamond Thermal grease contains 7 carats
of micronized diamond with diamond particle loadings @ 92% by weight, 94% after
10 minute dry-out prior to heat sink installation. Material loading above 90% is
recommended as the best combination of rheological and thermal properties to
minimize interface pump out due to thermal cycling. Superior bulk conductivity.
Excellent thermal impedance. Tight particle distributions. < 40 µ maximum
particle diameter. Silicone free. Lower viscosity. Greater stability. Non
capacitive or electrically conductive.
Application Instructions:
According to the manufacturer: "Due to the high amount of
diamond powder (94%) in IC Diamond Compound, the material is very thick. The
plunger on the syringe should not be forced which would result in its
breaking. Squeeze slowly using constant, even pressue - it will take
about 3-4 seconds to squeeze out the proper amount. Warming the Thermal compound
syringe in a cup of hot water for several minutes will enhance application.
Clean the CPU to ensure that it is clean of any grease or particulate matter.
Squeeze a pea-sized amount of IC Diamond in the center of the CPU and apply
the heatsink. Once the heatsink is mounted, the compound will spread out and
cover the entire CPU and settle into a uniform thickness in about 2 hours.
Savings Note: Covering the entire CPU is a waste of compound as any
excess is squeezed out - the final bond line is only .001 or .002 inches thick.
Single line and other application methods do not provide uniform coverage and
will require re-application for the best results."
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