Intel Socket LGA 1150 / 1155 / 1156 Backplate Kit with Screws & Springs
Product Description & Info
Intel continues to use plastic pushpins for its new Haswell platform. The plastic pushpins have been known since Socket 775 to provide little pressure for proper contact between the heatsink and integrated heatspreader. With this backplate from Sidewinder Computers, you can remove these pushpins and use our backplate and spring/screw retention system for superior thermal conductivity and lower temperatures, from between 1 and 5 Celsius. The LGA 1150/1155/1156 backplate kit will work with all Socket 1150, 1155 and 1156 processors.
Please note some motherboards such as the one illustrated in our iamges can have one or more solder joints near where the backplate mounts. The remedy for this issue is to carefully trim the joints using a needlenose cutter. For added protection, several layers of electrical tape can be applied to the backplate to prevent an electrical short.
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