Product Description & Info
This thermal interface compound was developed by Shin Etsu
Chemical Co., Ltd. to meet the current and future requirements of high
performance microprocessors. It is used to increase surface contact area for
heat transfer by minimizing any air bubbles that exist between the top of the
processor and the base of the heat sink.
Specifications
Size: 1 gram tube
Thermal Conductivity: 6.0 W/m K
Viscosity (Pascal * Second): 200
Specific Gravity: 2.6
Electrically Conductive: No
