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Shin-Etsu Thermal Compound - 1 Gram (X23-7783D)


Shin-Etsu Thermal Compound - 1 Gram (X23-7783D)

Shin-Etsu Thermal Compound - 1 Gram (X23-7783D)



Product Description & Info

This thermal interface compound was developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exist between the top of the processor and the base of the heat sink.

Specifications

Size:  1 gram tube
Thermal Conductivity:  6.0 W/m K
Viscosity (Pascal * Second):  200
Specific Gravity:  2.6
Electrically Conductive:  No




Availability: Usually ships the same business day

x23-7783-1g$7.99 Qty:
Shin-Etsu Thermal Compound - 1 Gram (X23-7783D)  

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