Introduction
NEW! Update 5-10-07:
The MC14 now receives an upgraded sticky pad with considerably enhanced
adhesion.
The MC14 is a BGA memory Ramsink made of forged copper and
optimized for convection cooling. It was designed for cooling of memory
components such as those found in graphic cards, but it works equally well with
motherboard VRM modules, compositing chips, or any SMC in need of superior
cooling.
It is a perfect companion to our VGA liquid cooling solutions thus allowing
high-end graphic cards to operate in virtual silence.
Features highlights
- The MC14 is made of forged copper. The density of the pins has been
calculated to offer maximum surface area to increase heat dissipation, while
allowing the heated air to circulate freely between the pins.
-
High quality thermal pads: the high quality
Thermattach™ T411 thermal tape offers excellent thermal conductivity
and adhesion to the memory modules.
-
Quick, safe and easy installation: simply peel-off
the protective paper, and press the Ramsink onto the component to be cooled.
-
Ideal companion to the MCW55 GPU water-block.
-
Sold in convenient pack of 8 pieces.
Performance and specifications
- Forged C110 copper
- 14mm (L) x 14mm (W) x 14.5mm (H)
- Weight: 0.3 oz (8.5 g)
- C/W: 9.0 (including TIM joint)
- Maximum recommended heat load: 5 Watts per heatsink
Swiftech conducted laboratory tests, comparing the MC14 to generic skived
copper units such as shown below, and found a 6°C improvement in component
temperature at a 5 Watts heat load.
|
Test
conditions
5 W heat load
25°C ambient
|
 |
vs.
|
|
|
Junction
temperature
|
76.8°C
|
70.3°C
|
For reference, maximum junction (core) temperature in current GDDR3 memory
modules is 125°C (link)
Installation
- Remove the existing heatsink
- Carefully clean the surface of the memory modules with a degreaser (Xylene
for example)
- follow the easy installation steps below
- Handle the heatsinks with care when they have just been installed onto the
memory. Heat developed by the memory in operations will strengthen the bond
of the thermal adhesive.
Step 1
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Step 2
|
Installation complete
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